Semiconductor Manufacturing International soared to a record high in China after Huawei unveiled what it described as a breakthrough pathway for advanced semiconductor production at the IEEE ISCAS conference, without relying on the West’s most advanced chipmaking equipment.
Huawei’s semiconductor chief, He Tingbo, told the audience earlier today that the company has developed a “New Semiconductor Path in Practice” that replaces traditional Moore’s Law-style geometric scaling with time scaling and reducing signal propagation delay across devices, circuits, chips, and systems.
